Welcome to our online Request for Quote (RFQ) service, where you can fill out and submit the form provided below to obtain tailored procurement options from our team of industry experts. You have taken interest in part number IDT72V36100L15PFI, which is a Microcircuit Memory item from Integrated Device Technology Inc that is listed with the NSN 5962-01-589-8596 for quick identification. Should you wish to move forward with quotation for this listing, be sure that you supply us with key details like your target pricing, quality, and delivery date. This information is what we will base presented quotes on, with responses offered shortly after the receipt and review of each form.
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To ensure that customers only procure exact items of need, we present our offerings with as much relevant data as possible. For example, part number IDT72V36100L15PFI was specifically produced by Integrated Device Technology Inc under the CAGE Code 61772, providing traceability. Furthermore, with the NSN 5962-01-589-8596, one can also determine that this listing falls under Federal Supply Class (FSC) 5962 Microcircuits Electronic. Alongside such details, all purchases will come delivered with any applicable qualifying certifications, furthering the reliability of our purchasing options. With this in mind, be sure to request a quote on part number IDT72V36100L15PFI, and we will be in touch.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-589-8596 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 015898596 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT72V36100L15PFI | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
| ADAU | Body Height | 1.6 MILLIMETERS MAXIMUM |
| CBBL | Features Provided | ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
| TTQY | Terminal Type And Quantity | 128 GULLWING |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | FLAT PACK |
| ABHP | Overall Length | 21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
| ADAT | Body Width | 13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
| CXCY | Part Name Assigned By Controlling Agency | 3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAQ | Body Length | 19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
| CTFT | Case Outline Source And Designator | MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQSJ | Inclosure Material | PLASTIC |
| ABMK | Overall Width | 15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
| CZEQ | Time Rating Per Chacteristic | 15.00 NANOSECONDS NOMINAL ACCESS |
| CZEN | Voltage Rating And Type Per Characteristic | 3.3 VOLTS NOMINAL INPUT |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | FIRST-IN FIRST-OUT |
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