Welcome to our online Request for Quote (RFQ) service, where you can fill out and submit the form provided below to obtain tailored procurement options from our team of industry experts. You have taken interest in part number S82S129W, which is a Microcircuit Memory item from Philips Semiconductors Ltd that is listed with the NSN 5962-01-076-6609 for quick identification. Should you wish to move forward with quotation for this listing, be sure that you supply us with key details like your target pricing, quality, and delivery date. This information is what we will base presented quotes on, with responses offered shortly after the receipt and review of each form.
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To ensure that customers only procure exact items of need, we present our offerings with as much relevant data as possible. For example, part number S82S129W was specifically produced by Philips Semiconductors Ltd under the CAGE Code 18324, providing traceability. Furthermore, with the NSN 5962-01-076-6609, one can also determine that this listing falls under Federal Supply Class (FSC) 5962 Microcircuits Electronic. Alongside such details, all purchases will come delivered with any applicable qualifying certifications, furthering the reliability of our purchasing options. With this in mind, be sure to request a quote on part number S82S129W, and we will be in touch.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-076-6609 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 010766609 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
HM9-7611-2 | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 910.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT AND SCHOTTKY AND HIGH SPEED AND EXPANDABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/DI |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 82577-932820 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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