Welcome to our online Request for Quote (RFQ) service, where you can fill out and submit the form provided below to obtain tailored procurement options from our team of industry experts. You have taken interest in part number P4C116-45LMB, which is a Microcircuit Memory item from Pyramid Semiconductor Corp that is listed with the NSN 5962-01-299-4554 for quick identification. Should you wish to move forward with quotation for this listing, be sure that you supply us with key details like your target pricing, quality, and delivery date. This information is what we will base presented quotes on, with responses offered shortly after the receipt and review of each form.
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To ensure that customers only procure exact items of need, we present our offerings with as much relevant data as possible. For example, part number P4C116-45LMB was specifically produced by Pyramid Semiconductor Corp under the CAGE Code 3DTT2, providing traceability. Furthermore, with the NSN 5962-01-299-4554, one can also determine that this listing falls under Federal Supply Class (FSC) 5962 Microcircuits Electronic. Alongside such details, all purchases will come delivered with any applicable qualifying certifications, furthering the reliability of our purchasing options. With this in mind, be sure to request a quote on part number P4C116-45LMB, and we will be in touch.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-299-4554 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012994554 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| P4C116-45LMB | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.292 INCHES MINIMUM AND 0.308 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.062 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS |
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